MANUFACTURING

Antenna & Array Manufacture

In addition to conventional manufacturing methods, SI2 utilizes multiple proprietary manufacturing techniques for its antenna, array and absorber system product lines. These methods include various Direct Write processes via Micropen and Inkjet systems as well as direct Laser Transfer. 

Direct Write

SI2's Direct Write processes print electronic circuits on low temperature and/or curved or flexible surfaces directly from a computer file.Roll-to-roll Direct Write inkjet system enables manufacture of conformal and large area flexible electronics.

 

 

 

 

 

 

 

Direct Write Key Attributes

  • Relatively low processing temperatures expands the number of substrate materials beyond those used in conventional electronics manufacture.
  • The conformal nature of the deposition enables the integration of electronics with curved surfaces - both active and passive electronics can be printed onto curved or flexible structural components for avionics integration.
  • No requirement for harsh etchants or special atmospheres (such as vacuum chamber conditions, high temperatures or use of special gases)
  • Capable of depositing a wide variety of materials (such as conductors, dielectrics, etc.) onto a number of substrates, including structural composites.

Conformal Printed Array on concave Kevlar surface. INSET: Direct Write printing of flexible and conformal antennas and arrays.

 

 

 

 

 

 

 

 

 

Laser Transfer

Laser Transfer prints pre-fabricated semiconductor chip-sized devices, such as receivers, amplifiers, and switches, directly onto curved substrates. Together with passive Direct Write interconnects and devices, Laser Transfer enables the manufacture of truly smart structures.

Laser Transfer Key Attributes

  • No special atmospheres are required
  • None of the traditional thin film transistor processing steps, such as laser recrystallization, are required
  • Accommodates standard, commercially available semiconductor devices manufactured using established techniques.
  • All fabrication of the actual on-chip microelectronics (lithography, implantation, metallization) takes place upstream of SI2’s transfer process.